模块特点 1. 高性能：采用高速数字信号处理器芯片，处理速度非常快，适用于需要高速数据处理和信号处理的场合； 2. 接口丰富：支持多种接口协议，方便与其他设备进行通信和数据交换； 3. 稳定性高：采用小型SOT23封装，散热性能好，稳定性高； 4. 易于集成：模块化设计，易于集成到各种设备中。Module Features 1. High performance: It adopts a high-speed digital signal processor chip, and the processing speed is very fast, which is suitable for situations where high-speed data processing and signal processing are required; 2. Rich interfaces: support a variety of interface protocols to facilitate communication and data exchange with other devices; 3. High stability: small SOT23 package, good heat dissipation performance and high stability; 4. Easy to integrate: modular design, easy to integrate into various devices.

技术参数 1. 工作电压：3.3V至5V； 2. 工作温度：-40℃至+85℃； 3. 存储温度：-55℃至+125℃； 4. 芯片尺寸：小型SOT23封装； 5. 处理器：高速数字信号处理器（DSP）芯片； 6. 内存：内置高速SRAM，可存储中间结果和临时数据； 7. 数据接口：支持SPI、I2C、UART等多种接口协议； 8. 编程语言：支持C、C++、汇编等多种编程语言； 9. 数据传输速率：最高可达几百兆比特每秒。

Technical parameter 1. Operating voltage: 3.3 V to 5 V; 2. Operating temperature: -40°C to +85°C; 3. Storage temperature: -55°C to +125°C; 4. Chip size: small SOT23 package; 5. Processor: high-speed digital signal processor (DSP) chip; 6. Memory: Built-in high-speed SRAM, which can store intermediate results and temporary data; 7. Data interface: support SPI, I2C, UART and other interface protocols; 8. Programming language: support C, C++, assembly and other programming languages; 9. Data transfer rate: up to hundreds of megabits per second.